Single-sided
FR-1, CEM-1 and high-CTI boards for appliances, audio and power electronics.
SINCE 2005 · HONG KONG HQ · HUIZHOU & HUANGSHI
Multilayer and HDI PCBs, from small batch to mass production.
1–24 layers, 230,000 m² of monthly capacity across two plants, and 21 years of supplying 50+ global brands — including Fortune 500 companies.
STABLE SUPPLY
QUALITY FOCUSED
IATF 16949
21 yrsPCB manufacturing
230k m²Monthly capacity
1–24LLayer count
1,350+Employees
50+Global brand customers
01 — CAPABILITIES
What we manufacture
Single-sided to 24-layer boards and 2-step HDI. Multilayer (4L+) now makes up 55% of our sales.
Double-sided & multilayer
Up to 24 layers on FR-4, high-Tg and high-CTI materials, with controlled impedance.
HDI
Piloted in 2025, in volume production since 2026, with more HDI capacity planned at Huangshi Phase 2.
Aluminium & CEM-3
Aluminium-based and CEM-3 boards, with 2-layer aluminium added in 2027.
| Capability | 2026 (current) | 2027 | 2028 | 2029 |
|---|---|---|---|---|
| Layer count | 1–24L | ↑ 1–32L | 1–32L | 1–32L |
| HDI build-up layers | 10 | ↑ 16 | ↑ 20 | 20 |
| Board thickness | 0.4–3.0 mm | ↑ 0.4–4.5 mm | 0.4–4.5 mm | 0.4–4.5 mm |
| Materials | FR-4 (high-Tg / CTI), FR-1, CEM-1/3, aluminium | ↑ + 2L aluminium | ↑ + Rigid-flex | + Rigid-flex |
| Line / space, inner | 3 / 3 mil | 3 / 3 mil | ↑ 2 / 2 mil | 2 / 2 mil |
| Line / space, outer | 2.75 mil | 2.75 mil | ↑ 2 mil | 2 mil |
| Aspect ratio | 10:1 | 10:1 | ↑ 12:1 | ↑ 20:1 |
| BGA pitch | 0.30 mm | ↑ 0.25 mm | 0.25 mm | 0.25 mm |
| Impedance / thickness tol. | ±10% / ±10% | ↑ ±8% / ±8% | ±8% / ±8% | ±8% / ±8% |
↑ = step-up on the previous year
Min. hole0.10 mm
Copper thickness12–170 µm
Max. panel size618 × 720 mm
Surface finishesOSP · LF-HASL · ENIG · immersion tin
02 — FACILITIES
Two plants, one standard
03 — QUALITY
Automotive-grade quality, recognised by government
ISO 9001Quality
IATF 16949Automotive
ISO 14001Environmental
ISO 45001Health & safety
IECQ QC 080000Hazardous substances
CQCProduct certification
UL · SGS · IntertekThird-party testing
HKPCAMember since 2009
HONOURS
High-tech EnterpriseRecognised 2025
Engineering Technology Research CenterHuizhou Science & Technology Bureau
IP Advantage EnterpriseHuizhou IP Office
04 — ABOUT US
Two decades of steady expansion
Founded in 2005 and headquartered in Hong Kong, Wing Hing Lung Electronics (WHL) makes PCBs at two plants in Huizhou and Huangshi. For over two decades we have built lasting partnerships with 50+ global brands, including Fortune 500 companies.
OUR VISION
To be our customers’ most trusted partner
- 01Fast & on-time delivery
- 02Consistent quality & continuous improvement
- 03Proactive, effective communication
- 04Globally competitive pricing
- 05Strong R&D capabilities
- 2005Hong Kong headquarters founded
- 2006Huizhou WingLung plant opens; US sales representative appointed
- 2010Huizhou Phase 2 in production
- 2019Huangshi Phase 1 in production
- 2025HDI pilot production
- 202610-layer, 2-step HDI in volume production
- NextHuangshi Phase 2
05 — ESG
Responsible manufacturing
E
National Green Factory and ISO 14001 certified. Advanced water treatment for recycling, and green electricity under I-REC standards.
S
ISO 45001 health & safety for every colleague. Scholarships and careers for young people, volunteer support for the elderly, and team activities all year.
G
Strict RoHS / REACH compliance, rigorous ESG supplier audits, and a Code of Conduct for transparent operations.
06 — GLOBAL
Local support, worldwide shipping
HEADQUARTERSHong Kong
FACTORIESHuizhou, Guangdong · Huangshi, Hubei
SALES OFFICESHuizhou · Huangshi · Seoul
SALES REPRESENTATIVESChicago · Ettlingen · Milan
07 — QUOTE
Send us your Gerbers
Our engineers review every enquiry and reply with a quote and DFM feedback.
wlmkt@winglungpcb.com
+852 2455 6028 (Hong Kong HQ)